E-PAC: Electronic Packaging Assembly Concept

E-PAC is an innovative foam assembly chassis for electromechanical devices. A new approach to electronic product assembly, E-PAC replaces conventional metal and plastic frame structures with parts made of expanded polypropylene (EPP) foam. For E-PAC applications, we mold EPP foam into relevant geometric shapes that hold components or sub-assemblies in place. The assembly eliminates the need for screws and snap-on fasteners traditionally used to secure components. Lightweight and sturdy, E-PAC parts molded from EPP foam provide sound attenuation and reduce mechanical stress on highly sensitive electronic components. The foam is also available with antistatic characteristics. UL approved.

E-PAC provides significant benefits:

Simple, less costly prototyping

Low-cost tooling

Higher quality assemblies at reduced manufacturing costs

Products that are more "customer friendly"

Ease of assembly and disassembly are designed into the application from the beginning

Recyclability of the E-PAC parts

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